High Density Interconnect PCBs »

  • Model: HDI PCB
Featuretechnical specification
Number of layers4 - 22 layers standard, 30 layers advanced
Technology highlightsMultilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
MaterialsFR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished)18μm - 70μm
Minimum track and gap0.075mm / 0.075mm
PCB thickness0.40mm - 3.20mm
Maxmimum dimensions610mm x 450mm; dependant upon laser drilling machine
Surface finishes availableOSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill0.15mm
Minimum laser drill0.10mm standard, 0.075mm advanced


Brand glory

Model AP08Q

10000mAh fast charging version of the honor mobile power source

Color black

Class mobile power supply

Version fast filling

Appearance straight


Core capacity 10000mAh

The input interface Micro USB or Type C

Output interface USB A

Input voltage DC 4.5V~5.5V, 8.1~9.9V, 10.8~13.2V

Output voltage DC 4.75V~5.25V, 8.55~9.45V

Input current 2A (max) @5V&9V, 1.5A (max) @12V

Output current 2A

Electricity indicator 3 white LED light +1 double color lamp (fast charging state is green, non fast charge state is white)

Touch type of key type

Working temperature charging temperature: 0 C ~ 45 C, discharge temperature: -10 C ~ 45 C


Size 139mm X 73.7mm X 15.5mm

The weight is about 216g (bare metal)

Mobile power supply x 1

Micro USB data line (20~22cm) x 1

Instructions (including a warranty card) x 1